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 MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
MC14068B See Page 6-5
Hex Inverter
The MC14069UB hex inverter is constructed with MOS P-channel and N-channel enhancement mode devices in a single monolithic structure. These inverters find primary use where low power dissipation and/or high noise immunity is desired. Each of the six inverters is a single stage to minimize propagation delays. * Supply Voltage Range = 3.0 Vdc to 18 Vdc * Capable of Driving Two Low-Power TTL Loads or One Low-Power Schottky TTL Load Over the Rated Temperature Range * Triple Diode Protection on All Inputs (see Page 5-2) * Pin-for-Pin Replacement for CD4069UB * Meets JEDEC UB Specifications MAXIMUM RATINGS* (Voltages Referenced to VSS)
Symbol VDD Parameter DC Supply Voltage
MC14069UB
L SUFFIX CERAMIC CASE 632
P SUFFIX PLASTIC CASE 646
IIIIIIIIIIIIIIIIIIIII I I I III I I I IIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIII I I I III I I I IIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIII I I IIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIII I IIIIIIII I I I IIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIII IIIIIIIIIIIIII I IIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIII I I IIIIIIIIIIIIIIIIIIIII IIII IIIIIIIIIIIIIIIIIIIII I I IIIIIIIIIIIIIIIIIIIII
Value Unit V V - 0.5 to + 18.0 Vin, Vout Iin, Iout PD Input or Output Voltage (DC or Transient) - 0.5 to VDD + 0.5 10 500 Input or Output Current (DC or Transient), per Pin Power Dissipation, per Package Storage Temperature mA mW Tstg TL - 65 to + 150 260
D SUFFIX SOIC CASE 751A
ORDERING INFORMATION
MC14XXXUBCP MC14XXXUBCL MC14XXXUBD Plastic Ceramic SOIC
TA = - 55 to 125C for all packages.
_C _C
Lead Temperature (8-Second Soldering)
PIN ASSIGNMENT
IN 1 OUT 1 IN 2 OUT 2 IN 3 OUT 3 VSS 1 2 3 4 5 6 7 14 13 12 11 10 9 8 VDD IN 6 OUT 6 IN 5 OUT 5 IN 4 OUT 4
* Maximum Ratings are those values beyond which damage to the device may occur. Temperature Derating: Plastic "P and D/DW" Packages: - 7.0 mW/_C From 65_C To 125_C Ceramic "L" Packages: - 12 mW/_C From 100_C To 125_C
LOGIC DIAGRAM
1 3 5 9 11 13 2 4 6 8 10 12 VDD = PIN 14 VSS = PIN 7
CIRCUIT SCHEMATIC (1/6 OF CIRCUIT SHOWN)
VDD
INPUT*
OUTPUT
VSS * Double diode protection on all inputs not shown. 20 ns VDD 14 OUTPUT INPUT 7 VSS CL 90% 50% 10% tPLH 90% 50% 10% tTHL tTLH 20 ns VDD VSS VOH VOL
PULSE GENERATOR
INPUT tPHL OUTPUT
Figure 1. Switching Time Test Circuit and Waveforms
REV 3 1/94
(c)MOTOROLA CMOS LOGIC DATA Motorola, Inc. 1995
MC14069UB 1
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II II II IIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II II II IIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II II II IIII III I I I I I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II II II IIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II II II IIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II II II IIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II II IIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II II II IIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II II II IIII III I I I I I I I I I I III IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II II II IIII III IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II II II IIII III IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I III IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II II II IIII III IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I I I I IIIIIIIIIIIIIIIII I II II IIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIII I I I III I I I I I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II II II IIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I III I I I I I I I I I II II II IIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II II II IIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II II II IIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II II II IIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II II II IIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II II II IIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II II IIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II II II IIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II II II IIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II II IIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II II II IIII III I I I I I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II II II IIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II II IIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II II II IIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II II II IIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II II II IIII III I I I I I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II II II IIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II II II IIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II II II IIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II II IIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II II II IIII III I I I I I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II II II IIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II II II IIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II II II IIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II II IIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II II II IIII III I I I I I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II II II IIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II II II IIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II II II IIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II II IIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II II II IIII III I I I I I I I I I I II IIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II II II IIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II II II IIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II II II IIII III IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II II II IIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II II II IIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II II II IIII III IIII I III IIIIIIIIIIIIIIIII II II II IIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II II II IIII IIIII IIIIII IIII I I I II II II IIII I I III IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I III IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I III IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
** The formulas given are for the typical characteristics only at 25_C. #Data labelled "Typ" is not to be used for design purposes but is intended as an indication of the IC's potential performance.
To calculate total supply current at loads other than 50 pF:
IT(CL) = IT(50 pF) + (CL - 50) Vfk where: IT is in A (per package), CL in pF, V = (VDD - VSS) in volts, f in kHz is input frequency, and k = 0.002.
ELECTRICAL CHARACTERISTICS (Voltages Referenced to VSS)
Propagation Delay Times** (CL = 50 pF) tPLH, tPHL = (0.90 ns/pF) CL + 20 ns tPLH, tPHL = (0.36 ns/pF) CL + 22 ns tPLH, tPHL = (0.26 ns/pF) CL + 17 ns
Output Rise and Fall Times** (CL = 50 pF) tTLH, tTHL = (1.35 ns/pF) CL + 33 ns tTLH, tTHL = (0.60 ns/pF) CL + 20 ns tTLH, tTHL = (0.40 ns/pF) CL + 20 ns
Total Supply Current** (Dynamic plus Quiescent, Per Gate) (CL = 50 pF)
Quiescent Current (Per Package)
Input Capacitance (Vin = 0)
Input Current
Output Drive Current (VOH = 2.5 Vdc) (VOH = 4.6 Vdc) (VOH = 9.5 Vdc) (VOH = 13.5 Vdc)
Input Voltage (VO = 4.5 Vdc) (VO = 9.0 Vdc) (VO = 13.5 Vdc)
Output Voltage Vin = VDD
MC14069UB 2
(VO = 0.5 Vdc) (VO = 1.0 Vdc) (VO = 1.5 Vdc) Vin = 0 (VOL = 0.4 Vdc) (VOL = 0.5 Vdc) (VOL = 1.5 Vdc) Characteristic "1" Level "1" Level "0" Level "0" Level Source Sink Symbol tPLH, tPHL tTLH, tTHL VOH VOL IOH IDD VIH IOL Cin VIL Iin IT VDD Vdc 5.0 10 15 5.0 10 15 5.0 10 15 5.0 10 15 5.0 10 15 5.0 5.0 10 15 5.0 10 15 5.0 10 15 5.0 10 15 5.0 10 15 15 -- - 3.0 - 0.64 - 1.6 - 4.2 4.95 9.95 14.95 4.0 8.0 12.5 0.64 1.6 4.2 Min -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- - 55_C 0.1 0.25 0.5 1.0 0.05 0.05 0.05 Max 1.0 2.0 2.5 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- - 2.4 - 0.51 - 1.3 - 3.4 4.95 9.95 14.95 4.0 8.0 12.5 0.51 1.3 3.4 Min -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- 0.00001 0.0005 0.0010 0.0015 - 4.2 - 0.88 - 2.25 - 8.8 Typ # 25_C 0.88 2.25 8.8 2.75 5.50 8.25 2.25 4.50 6.75 100 50 40 5.0 5.0 10 15 65 40 30 0 0 0
This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, Vin and Vout should be constrained to the range VSS (Vin or Vout) VDD. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either VSS or VDD). Unused outputs must be left open.
IT = (0.3 A/kHz) f + IDD/6 IT = (0.6 A/kHz) f + IDD/6 IT = (0.9 A/kHz) f + IDD/6
MOTOROLA CMOS LOGIC DATA
0.1 0.25 0.5 1.0 0.05 0.05 0.05 Max 125 75 55 200 100 80 7.5 1.0 2.0 2.5 -- -- -- -- -- -- -- -- -- -- -- -- -- - 1.7 - 0.36 - 0.9 - 2.4 4.95 9.95 14.95 4.0 8.0 12.5 0.36 0.9 2.4 Min -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- 125_C 1.0 0.05 0.05 0.05 Max 7.5 15 30 1.0 2.0 2.5 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- mAdc mAdc Adc Adc Adc Unit Vdc Vdc Vdc Vdc pF ns ns
OUTLINE DIMENSIONS
L SUFFIX CERAMIC DIP PACKAGE CASE 632-08 ISSUE Y
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIMENSION F MAY NARROW TO 0.76 (0.030) WHERE THE LEAD ENTERS THE CERAMIC BODY. INCHES MIN MAX 0.750 0.785 0.245 0.280 0.155 0.200 0.015 0.020 0.055 0.065 0.100 BSC 0.008 0.015 0.125 0.170 0.300 BSC 0_ 15_ 0.020 0.040 MILLIMETERS MIN MAX 19.05 19.94 6.23 7.11 3.94 5.08 0.39 0.50 1.40 1.65 2.54 BSC 0.21 0.38 3.18 4.31 7.62 BSC 0_ 15_ 0.51 1.01
-A-
14 9
-B-
1 7
C
L
-T-
SEATING PLANE
K F D
14 PL
G 0.25 (0.010)
M
N J TA
S 14 PL
M 0.25 (0.010)
M
TB
S
DIM A B C D F G J K L M N
P SUFFIX PLASTIC DIP PACKAGE CASE 646-06 ISSUE L
14 8
B
1 7
NOTES: 1. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE POSITION AT SEATING PLANE AT MAXIMUM MATERIAL CONDITION. 2. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 3. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 4. ROUNDED CORNERS OPTIONAL. DIM A B C D F G H J K L M N INCHES MIN MAX 0.715 0.770 0.240 0.260 0.145 0.185 0.015 0.021 0.040 0.070 0.100 BSC 0.052 0.095 0.008 0.015 0.115 0.135 0.300 BSC 0_ 10_ 0.015 0.039 MILLIMETERS MIN MAX 18.16 19.56 6.10 6.60 3.69 4.69 0.38 0.53 1.02 1.78 2.54 BSC 1.32 2.41 0.20 0.38 2.92 3.43 7.62 BSC 0_ 10_ 0.39 1.01
A F C N H G D
SEATING PLANE
L
J K M
MOTOROLA CMOS LOGIC DATA
MC14069UB 3
OUTLINE DIMENSIONS
D SUFFIX PLASTIC SOIC PACKAGE CASE 751A-03 ISSUE F
-A-
14 8
-B-
1 7
P 7 PL 0.25 (0.010)
M
B
M
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION.
G C
R X 45 _
F
-T-
SEATING PLANE
D 14 PL 0.25 (0.010)
M
K TB
S
M A
S
J
DIM A B C D F G J K M P R
MILLIMETERS MIN MAX 8.55 8.75 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0_ 7_ 5.80 6.20 0.25 0.50
INCHES MIN MAX 0.337 0.344 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0_ 7_ 0.228 0.244 0.010 0.019
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. "Typical" parameters which may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer. How to reach us: USA/EUROPE/Locations Not Listed: Motorola Literature Distribution; P.O. Box 20912; Phoenix, Arizona 85036. 1-800-441-2447 or 602-303-5454 MFAX: RMFAX0@email.sps.mot.com - TOUCHTONE 602-244-6609 INTERNET: http://Design-NET.com
JAPAN: Nippon Motorola Ltd.; Tatsumi-SPD-JLDC, 6F Seibu-Butsuryu-Center, 3-14-2 Tatsumi Koto-Ku, Tokyo 135, Japan. 03-81-3521-8315 ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park, 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852-26629298
MC14069UB 4
*MC14069UB/D*
MOTOROLA CMOS LOGIC DATA MC14069UB/D


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